Publications related to IC-EMC

2021

Boyer A., N. Nolhier, F. Caignet, Ben Dhia S., "Closed-Form Expressions of Electric and Magnetic Near-Fields for the Calibration of Near-Field Probes", IEEE Transactions on Instrumentation and Measurements, Early Access, vol. 70, pp. 1-15, November 9th 2021, 10.1109/TIM.2021.3126376
Boyer A., N. Nolhier, F. Caignet, Ben Dhia S., "Anticipating Common-Mode Conducted Emission of DC-DC Converter from Electric Near-Field Scan", 2021 Joint IEEE International Symp. On EMC, SI & PI, and EMC Europe, August 2021, Virtual Conference.

2020

Boyer A., Ben Dhia S., Durier A., "A new Voltage Measurement Probe for investigating Radiated Immunity Test", EMC Europe 2020, September 2020, Virtual Conference
Boyer A., Ben Dhia S., "Low-Cost Broadband Electronic Coupler for Estimation of Radiated Emission of Integrated Circuits in TEM Cell", IEEE Transactions on Electromagnetic Compatibility, vol. 63, no 2, April 2021, pp. 636-639, 10.1109/TEMC.2020.3021135

2019

Sicard E., Technology Trends and Electromagnetic Compatibility of Integrated Circuits" , Keynote speaker, EMC Compo 2019, October 2019, China
Boyer A., Sicard E., Extended version of "A Case Study to apprehend RF Susceptibility of Operational Amplifiers" , EMC Compo 2019, October 2019, China
Boyer A., Sicard E., Presentation of "A Case Study to apprehend RF Susceptibility of Operational Amplifiers" , EMC Compo 2019, October 2019, China

2017

Gil-Ortego R., Castro-Gil M., Tzanova S., Sicard E. "Work in Progress: MicroElectronics Cloud Alliance - The design of new Open Educational Resources for a Educational Cloud", Microelectronics Systems Education MSE 2017, May 2017 (Link)
Zouaoui M., Sicard E., Jacquemod G., Rudelou G., Marsy E., Braquet H., "Impact of NFSI on the clock circuit of a Gigabit Ethernet switch", EMC Compo 2017, St Petersburg, Russia, July 2017(Slides)
A. Boyer, C. Ghfiri, M. Gonzalez Sentis, A. Durier, " Modeling methodology of the conducted emission of a DC-DC converter board", EMC Compo 2017, St Petersburg, Russia, July 2017
A. Boyer, C. Ghfiri, M. Gonzalez Sentis, A. Durier, " Study of the thermal aging effect on the conducted emission of a synchronous buck converter", EMC Compo 2017, St Petersburg, Russia, July 2017
C. Ghfiri, A. Boyer, A. Durier, S. Ben Dhia, C. Marot, "Methodology of modeling of the internal activity of a FPGA for conducted emission prediction purpose", EMC Compo 2017, St Petersburg, Russia, July 2017
S. Serpaud, A. Boyer, C. Ghfiri, A. Durier, "Proposal for combined conducted and radiated emission modeling for Integrated Circuit", EMC Compo 2017, St Petersburg, Russia, July 2017
Boyer A., Sicard E. "Basis of Electromagnetic Compatibility of Integrated Circuits - A modeling approach using IC-EMC", Presses Universitaires du Midi, Oct. 2017, ISBN 978-2-8107-0522-1(Link)
A. Boyer, C. Ghfiri, M. Gonzalez Sentis, A. Durier, " Study of the thermal aging effect on the conducted emission of a synchronous buck converter", EMC Europe 2017, Angers, France, September 2017
C. Ghfiri, A. Boyer, A. Durier, S. Ben Dhia, C. Marot, "Methodology of modeling of the internal activity of a FPGA for conducted emission prediction purpose", EMC Europe 2017, Angers, France, September 2017
A. Boyer, "Learning EMC of ICs with IC-EMC", EMC Europe 2017, Angers, France, September 2017 (slides)

2016

Massiva Zouaoui, Gilles Jacquemod, Etienne Sicard, Ghislain Rudelou, Emmanuel Marsy and Henri Braquet, "Radiated Immunity of the Gigabit Ethernet Switch embedded in an Industrial Programmable Logic Controller", 2016 IEEE Int. Symp on EMC, Ottawa, 25-29 July 2016 (PDF)
C. Ghfiri, A. Boyer, A. Durier, C. Marot, S. Ben Dhia, "Construction of an Integrated Circuit Emission Model of a FPGA", 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity, May 18 – 21, 2016, Shenzhen (PDF)
A. Boyer, H. Huang, S. Ben Dhia, " Predicting the Risk of Non-Compliance to EMC Requirements During the Life-Cycle", 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity, May 18 – 21, 2016, Shenzhen (PDF)
Chaimae Ghfiri, Alexandre Boyer, André Durier, Sonia Ben Dhia, C Marot. CONSTRUCTION D'UN MODELE ICEM POUR PREDIRE L'EMISSION ELECTROMAGNETIQUE D'UN FPGA. 18e Colloque International et Exposition sur la Compatibilité Electromagnétique (CEM2016), Jul 2016, Rennes, France. 5p., 2016 (PDF)

2015

E. Sicard, A. Boyer "IC-EMC, Simulation of Electromagnetic Compatibility of Integrated Circuits", Microwave & RF, CNIT Paris, April 2015 (Slides)
E. Sicard, keynote talk: "Future needs in EMC of ICs: Are you hearing the voice of Industry", EMC Compo 2015, Edinburgh, 10-13th Nov, 2015
A. Boyer, B. Vrignon, J. Shepherd, M. Cavarroc, "Near-Field Injection At Die Level", 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, May 25 – 29, 2015, Taipei
V. Tomasevic, A. Boyer, S. Ben Dhia, " Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs", 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, May 25 – 29, 2015, Taipei
H . Huang, A. Boyer, S. Ben Dhia, B. Vrignon, "Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier", 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, May 25 – 29, 2015, Taipei
V. Tomasevic, A. Boyer, S. Bendhia, A. Steinmar, B. Weiss, E. Seebacher, P. Rust, "Coupling Study in Smart Power Mixed ICs with a dedicated On-Chip sensor", EMC Europe 2015, August 2015, Dresden, Germany
H. Huang, A. Boyer, S. Ben Dhia, " Passive device degradation models for a electromagnetic emission robustness study of a buck DC-DC converter", EMC Europe 2015, August 2015, Dresden, Germany
E. Sicard, A. Boyer, " EMC modeling of Integrated Circuits using IC-EMC", EMC Compo 2015, Edimburgh, Scotland, November 2015 (PDF)
A. Boyer, M. Cavarroc, "Improvement of the Spatial Resolution of Near-Field Immunity Maps", EMC Compo 2015, Edimburgh, Scotland, November 2015

2014

Jianfei Wu, Boyer, A., Jiancheng Li, Vrignon, B., Ben Dhia, S., Sicard, E., Rongjun Shen, "Modeling and Simulation of LDO Voltage Regulator Susceptibility to Conducted EMI", IEEE Transactions on EMC, Vol 56, No 3, pp726 - 735, June 2014
E. Sicard, A. Boyer, S. Serpaud, "Retour d’expérience d’une formation EURODOTS en compatibilité électromagnétique des circuits intégrés", revue en ligne J3EA, Mai 2014 (Télécharger le PDF)

2013

E. Sicard, Wu Jian-fei, Li Jian-cheng, "Signal integrity and EMC performance enhancement using 3D Integrated Circuis – A Case Study", EMC Compo 2013, Nara, Japan
J. Wu, E. Sicard "Recent Advances in 3D-IC EMC Measurement Methods", PIERS 2013, Stockholm, Sweden
E. Sicard "Electromagnetic Compatibility Of Integrated Circuits, Measurement, Modelling And Design Techniques", Invited talk to the 50th Workshop der Multi Projekt Chip Gruppe, July 12th, 2013, Konstanz, Germany

2012

E. Sicard "Trends in integrated circuit vulnerability to electromagnetic interference", Invited talk to Anadef 2012, 8-10 June 2012, Seignosse, France
E. Sicard, A. Boyer, "A Hands-on Approach to Make Electromagnetic Compatibility of Integrated Circuits Relevant to Engineers and Students", EWME, 9-11 May, 2012 - Grenoble, France
E. Sicard, M. Ramdani, S. Akue Boulingui, "Recent advances in integrated circuit immunity to radio-frequency interference", Radio-Sciences Bulletin, Vol. 340, pp. 36-52, URSI, March 2012
J. Wu, J. Li, A. Boyer, E. Sicard, S. Ben Dhia, R. Shen "EMC Susceptibility Study of Low-dropout Voltage Regulator Using a Test Chip", APEMC 2012, Asia-Pacific Electromagnetic Compatibility Symposium and Technical Exhibition, Singapore, May 21-24, 2012

2011

E. Sicard, A. Boyer, IC-EMC v2.0 User's Manual, "Generation Austin", June 2009, ISBN 978-2-87649-056-7
Wu Jian-fei, E. Sicard, A. Cissé Ndoye, F. Lafon, Li Jian-cheng, Shen Rong-jun, "Investigation on DPI Effects in a Low Dropout Voltage Regulator", EMC Compo 2011, Dubrovnick, Croatia, November 2011
E. Sicard, A. Boyer "Enhancing Engineers Skills in EMC of Integrated Circuits - A Practical Experience using IC-EMC", EMC Compo 2011, Dubrovnick, Croatia, November 2011
E. Sicard, A. Boyer, tutorial "IC Immunity Modeling", EMC Compo 2011, November 2011, Dubrovnik, Croatia
A. Boyer, S. Ben Dhia, special session & tutorial "Initiation to the modeling and simulation of susceptibility of integrated circuits to electromagnetic interferences", AP-EMC 2011, May 2011, Jeju Island, Korea

2010

A. Boyer, training "Introduction to the modeling and simulation of electromagnetic compatibility of integrated circuits", AP-EMC 2010, Apil 2010, Beijing, China

2009

M. Ramdani, E. Sicard, A. Boyer, S. Ben Dhia, J. J. Whalen, T. Hubing, M. Coenen, O. Wada, "The Electromagnetic Compatibility of Integrated Circuits - Past, Present and Future", IEEE Transaction on EMC, Vol. 51, N°1, pp 78-100, February 2009

2008

C. Labussière, S. Ben Dhia, E. Sicard, J. Tao, H. J. Quaresma, C. Lochot, B. Vrignon, "Modeling the Electromagnetic Emission of a Microcontroller Using a Single Model", IEEE Transactions on EMC, Vol. 50, N°1, pp 22-34, February 2008.
A. Boyer, L. Roy, E. Sicard and B. Tamer, "New Cube Probe Structures for an Integrated Near Field Scanner Module", Electronics Letters, May 2008, Volume 44, Issue 11, p. 667-669

2007

A. Boyer, S. Bendhia and E. Sicard "Characterization of the Electromagnetic Susceptibility of Integrated Circuits using a Near Field Scan", Electronics Letters, the IEE society, Volume 43, Issue 1, p. 15-16, Jan 2007

Update January 2022